Thermal

Thermal simulations

Thermal analysis is performed at every stage of the design process, from the conceptual work phase, through product implementation, optimization and final verification. It includes both the electronic and mechanical parts. 

Electronic designers in cooperation with mechanical engineers develop a preliminary concept for the device based on customer requirements. In the next step, electronic models (PCBs) and mechanical models (housing, connectors, passive and active cooling systems) are prepared. The developed models are then integrated into a simulation environment and subjected to preliminary thermal analysis. This process occurs under certain operating conditions such as ambient temperature or atmospheric pressure. The results thus obtained indicate a the course  for further modification of the device’s design.


What do thermal simulations provide us with?

  • Reducing the cost of developing electronic components;
  • An efficient and fast PCB design process;
  • Visualization of temperature distribution;
  • Verification of the correct operation of electrical circuits on the PCB;
  • Extracting critical data;
  • Optimization of the design for reliability.

What do we simulate?

  • Steady-state thermics – the final temperature distribution under assumed conditions;
  • Transient thermics – the distribution of temperature under assumed conditions after a certain period of time;
  • Linear/non-linear thermics;
  • Termikę pasywnych i aktywnych układów chłodzenia;
  • Przepływ cieczy i gazów.

Coupled simulations – what are they?

The convergence of mechanical and electronic design processes, necessitated by miniaturization, requires that changes to the electronic design be updated along with the mechanical design. Moreover, the traditional two-dimensional approach to PCB thermal design and simulation has now been significantly enhanced by 3D visualization technology. This use of software can significantly reduce the time to market.

Coupled simulations can not only be used  by experts on thermal issues but also by electronic engineers as well as by mechanics. Such a solution allows us to verify solutions to more complicated cooling problems very quickly.

By directly integration with PCB design tools, the error-sensitive and time-consuming process of converting input files is also eliminated. The ability to filter the data (e.g., rejecting components that generate negligible losses) reduces simulation time.

The simulation environment also provides the automatic creation of computational grids (meshing) and controls the convergence of simulation results. In addition to this, it has a user-friendly graphical user interface and allows you to create your own models and efficiently simulate the most complex systems. All of this allows for a measurable reduction in the time required for thermal simulations compared to other tools of this type.


Other competencies

Surface Mounting (SMT)
Process
Electronics